Bernstein Wafer Tweezer 9 mm Jaw With Graduated Lower Paddle and 3 Teeth 3 DWF With ESD

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Description

Bernstein Wafer Tweezer 9 mm Jaw With Graduated Lower Paddle and 3 Teeth 3 DWF With ESDOverview For positioning of flat and fine components, e. g. extremely sensitive and breakable wafer (Glass wafer etc.) fine PCB's and LCD's very smooth and non reflective surface high grade steel SA, anti magnetic. Specifications Brand Bernstein Product Type Wafer Tweezer Length 130 mm Weight 14 g Special Features With graduated lower paddle and 3 teeth 3 DWF With ESD Coating For Wafer Size 2 in Jaw Size 9 mm Resources Product Brochure

max and time from start of readout (in ROLL mode

Captive and swiveling bit magazine for easy removal and safe storage of bits

Overall Length: 2m

highly precise and repeatable

310mm long

8 mm single-core solder wires

Flow rate: 15 SLPM

Measures from 10 A to 2000 A DC

fully polished solid forged head and shaft from one single piece fine grain high carbon steel correctly hardened and tempered with a lacquer coating for rust protection

Fuel injectors

Made of 100 % diamond-turned germanium with an engineered coating

Parallel Shank

Exchange/Return Notes